I have the finest tip for the paste, but I find the problem is not the amount that comes out, but the fact that it doesnt tend to break from the tip and instead when I have just enough paste on and try to lift away the paste comes with it, not staying on the pads at all. I overcome this with the larger 0805+ size pads as it sticks to the pad just fine, but anything lower doesnt and it becomes awkward.
I was thinking if I got the stencils I could cut out the pads for specific ICs and passives very close to the holes so they could be placed in pretty fine but still have enough kapton around to allow the paste to the applied over it. Its just an interesting idea I keep thinking of trying.