Hello everyone,
Some background. I have been doing homemade through hole PCB for awhile now. I used the toner transfer method with an iron and have recently upgraded to the laminator. I am not transitioning to the surface mount designs at home. I am running into an odd phenomenon that I haven’t been able to find a resolution to. I have an idea what the cause is but I just wanted to run it by someone else for verification and possible resolutions.
The issue is that when I am doing the reflow in the toaster oven the board cooks (turns brown). This is a cosmetic issue but it also a performance issue because the cooking also makes the board adhesive bubble underneath the copper. I am suspecting the problem is the oven because of how it is heated. I am using a black and decker toaster over. It has warm, bake, broil, and toast settings. I have tried bake, broil, and toast with the same results. I suspect the issue is from the direct heat of the toaster over and the heating element locations. It is doing more of a direct heating rather then a convection heating but at the same time I have read many posts about the same setup as me with no issues.
My heat cycle is to turn the oven on and let it hit 85C before I turn it off for two minutes. This allows it to ramp up to 125C and flatten out. I turn the oven back on and watch for reflow (with my solder paste that appears to be around 165C, when the paste is shiny). I let the paste be shiny for maybe 30 seconds and shut the oven off. I then let it soak for about 15 seconds and open the door for cooling off.
So any ideas on my board baking problem or any improvements to the process?