As you can see this component has its pads underneath the package (slightly visible from the side when I inspect the real thing), so would I be correct if the “recommended layout” in the datasheet is only for reflow soldering, and I need to make the pads much wider to do this by hand soldering?
Extending the width of the pads on both sides by about 3mm (0.11 ") will do then?
By the way, will a recommended layout work for handsoldering TSSOP/MSSOP (0.65 mm pitch) and TSOT (1 mm pitch) components or will I also have to extend that?
As you can see this component has its pads underneath the package (slightly visible from the side when I inspect the real thing), so would I be correct if the “recommended layout” in the datasheet is only for reflow soldering, and I need to make the pads much wider to do this by hand soldering?
It looks like the pads are sticking out 0.4mm past the edge of the inductor. That is enough to hand solder. No need to modify the footprint in my opinion.
I don’t usually have any problems hand soldering anything with a footprint intended for reflow soldering. The correct size tip and temperature are important, of course, and fluxing the pads first is a good idea. I use a no-clean flux pen.