Yes, it’s fine, and you can use a track that’s as thick as the pad if you like.
Assuming you’re mass producing the board, your CEM should profile it before committing to a large run. This process involves analysing the board layout and choosing a reflow profile accordingly. Normally it’s large components like big ICs which end up as the cold spots that need some extra heat.
If you’re soldering by hand then it’s a non-issue, just hold the soldering iron on the component a little longer until the solder starts to flow properly. You may possibly find components are a bit more difficult to remove should you need to - in which case two soldering irons are better than one!