I am just getting started with electronics and I want to make a breakout board for a ti cc1020 transceiver chip which is a 7x7 mm QFN32 package. I am using the Eagle library editor to create the package and the documentation for the chip contains a good description of the footprint, but I have run into a bit of a problem.
There is a large pad under the chip 5.08x5.08mm which is to contain 9 uniformly spaced 0.254mm vias and this pad is to be attached to analog ground (AGND). I can use the “hole” command to add holes to this large pad, but EAGLE help describes these holes as having no electrical connection between layers. I was thinking of adding a matching pad to the package definition on layer 16 Bottom so that I can attach this large pad to AGND, but I am concerned about connecting the bottom layer pad to the matching top layer pad.
Is this a reasonable approach? Is there a standard method for routing a signal path to the pad under a QFN package?
I have done most of the SparkFun embedded programming tutorial and I am working on a car alarm for my son’s Cub Scout pine-wood derby car. I hope to use the CC1020 chip to implement a remote control and want to do the breakout board to get some experience with batchPCB. I apologize for the newb question.