Hello, and thanks for all the good information here!
I have been reading your reflow tutorials with much interest for some time now. We occasionally solder boards at work, and I have brought in a hot air pencil to help with this. It has been a great help.
Now I am faced with a new problem. I need to prototype some boards with a Texas Instruments TPA2032D1. This is a tiny 9 ball BGA chip. TI lables the package 9 DSBGA. I will be ordering a stencil to get the correct amount of paste on the pads, and would like your advice for how best to reflow. I have seen a lot of documentation that temperature rise time is quite important when reflowing such small amounts of solder paste. If it is too slow, flux can dry and paste won’t flow well when it reaches melting temperature. What heats faster/better, toaster oven or skillet? Any other thoughts or advice?
I could buy an inexpensive rework station if there is a major advantage to it, but I won’t be doing this very often.
Thanks