BGA soldering using hot air reflow or the Hot Plate Special?

Archive SparkFun Site Questions/Comments
1

Before I design around this package, I’m wondering if anyone here has had any luck with hot air reflow or the Spark Fun Hot Plate method. Suggestions are welcome. Thanks :slight_smile:

2

Both worked for us. The problem is not the soldering - any hot-air rework station can get the balls to flow, the problem is testing. So far we’ve stuck with BGA ICs that can be easily electrically tested. Other, more fun but complex ICs, require optical inspection and/or x-ray inspection. We ain’t got lead jackets. :slight_smile:

-Nathan

3

Heh, well I’ll anxiously await the Spark Fun Home X-Ray Imager tutorial, but until then I’ll keep that in mind :slight_smile:

Thanks for the awesome site.

-Mark