I have not found anyone using the SOT23-8 package. I’m
wondering if it can be fabbed by BatchPCB?
Also, does anyone have an EAGLE library for this package?
Hi bigglez,
Is that a 0.65mm pitch part with 0.45mm pads? if so, the 0.2mm spacing between pads is about 8 mil, which should be okay, right?
http://www.intersil.com/data/pk/P8.064.pdf
hope that helps 
silic0re:
Is that a 0.65mm pitch part with 0.45mm pads? if so, the 0.2mm spacing between pads is about 8 mil, which should be okay, right?
Yes, and thanks for the linked package drawing.
The part I’m considering is from TI, I believe the SOT23-8
is registered and standard, but so far I haven’t found a
recommended PCB footprint.
I’ll give it a try in EAGLE - a breakout board is the only
why I can power the IC up for eval. I thought these
were going to be MSOP-8, then I got the samples…
After some searching, I found a land pattern for this part:
http://www.pa.msu.edu/hep/d0/ftp/run2b/ … d_pads.pdf
Hope that helps folks. If anyone wants it, I could upload an EAGLE library part for this.
But, if you were going to use a part in the SOT23-8 package, there would most likely be a recommended land pattern in its datasheet…
The PCB Matrix LP Calculator has the IPC footprint (SOT80P330X140-8N) in one of the libraries. It shows the lead pitch as 0.8 mm. Is the JEDEC name given? That is unambiguous.
Leon
FartingMonkey92:
But, if you were going to use a part in the SOT23-8 package, there would most likely be a recommended land pattern in its datasheet…
One would think so… oddly, this TI part I am using (TLV3502) doesn’t include one and searching for one proved pretty much fruitless, except for this one doc.
Did a search of the TI wesite, and found this:
http://focus.ti.com/general/docs/symfoo … int&pins=8
I had to follow a couple of links from what I found on my search. Not sure if any of these footoprints can be used, though. Depends on whether you can translate them from the apps they were made for.
A good place to for packages, [here.
No land-patterns but you can work-out how big your pads need to be for good fillets…](Packaging | TI.com)
falingtrea:
Did a search of the TI wesite, and found this:http://focus.ti.com/general/docs/symfoo … int&pins=8
I had to follow a couple of links from what I found on my search. Not sure if any of these footoprints can be used, though. Depends on whether you can translate them from the apps they were made for.
I imported the PADS file into Pulsonix without any problems. The pad pitch is 0.65 mm. the pads are 0.4 x 1.4 mm, and the spacing is 2.2 mm.
Leon
FYI, here is the main page for TI packages. If you know the designator, you can see if they have footprints available. This is where I found the footprint info I listed in a previous message.
falingtrea:
“FYI, here is the main page for TI packages.”
FYI, thats what i linked to…
The original thread is a year old.
TheDirty:
“The original thread is a year old.”
I know that, but i didn’t resurrect it…