I’m laying out a PCB for use with an ATtiny43U. This is the micro with the on board boost converter. Atmel has an app note for recommended layout which I am following but I am confused about the ground pours.
App note: http://www.atmel.com/dyn/resources/prod … oc8206.pdf
page 6.
From what I understand Is I don’t use a ground pour on the top layer amongst the boost converter section. But I’m unsure about the bottom layer under the boost converter section of the PCB. Do I want a ground pour there?