I’ve found that all SMD parts are easy to get off with hot air - easier than pin-through-hole - less solder to melt. I’ve only removed leaded-type packages, not a leadless one, but I can’t imagine a leadless package is all that hard to get off with hot air.
My challenge tonight is to solder an LQFP80-10 (80 pins, 20 pins a side, 20 pins crammed into 8mm)… onto a home made PCB. I’ve found for hand soldering things like SSOP which are not much bigger pitch, drag soldering and solder wick to suck up the excess works very well for this kind of thing. For fluxing, I have a ‘no clean’ flux pen, which seems to dispense the proper amount of flux.