that schematic is very poorly done. I think it was connected with wires and not nets. It’s not at all clear what the intent is with respect to gnd. ERC gets lots of warnings. The main IC part is poorly made - no pin names and so on.
On the board, there are tons of DRC errors. Pretty much of a mess. Sorry. The board has text in the top layer that cause a lot of the violations. Move those to tplace and you should be better. There there are clearance errors that need to be cleaned up. Also, a gnd plane on top will really simplify it.
edit: I took a look at the datasheet. There are a number of things the designer shouldn’t have ignored. Read the datasheet it is fairly thorough.
That is a really nice chip. Basically an entire Bluetooth module in a chip, with antenna and everything. It’s $24 USD from Digikey here, but it doesn’t come in a nice SO package like the outlined board above. It comes in a crazy LTCC package. Reflow only. It’s still kinda tempting, but the choice would be much easier if it came in the nice SOIC style packaging above.
I see. I thought the above board was for soic, but they just did not create pads for connects 33 through 40, which is under the chip, between the chip and antenna.
the datasheet says to solder those for mechanical stability. The DS also says to use a ground plane and several other recommendations that the designer ignored or was unaware of.