Hi
(problem: any idea how to attach the images, tried several times with the upload attachment tab + inline,
but when posting the attachment disappear, you can see the pictures also here http://e2e.ti.com/support/low_power_rf/ … 05746.aspx)
this is my real first PCB desgin
[attachment=1]cc2540_try6.zip[/attachment]
it should be bee board http://www.seeedstudio.com/wiki/Bluetooth_Bee with TI cc2540/cc2541 bluetooth low energy MCU http://www.ti.com/product/cc2540&DCMP=L … +OT+cc2540
I probably made design mistakes and will be glade to hear from you
first, this is small board so used
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8mil data track size, 10-16 mil GND and VCC track size
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8mil clearance
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8mil distance
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20mil drill
can really batchPcb handle it? (the site say yes)
some specific questions
up area
[attachment=0]up.gif[/attachment]
- I design the PCB antenna from spec http://www.ti.com/lit/an/swra117d/swra117d.pdf
DRC return overlap error of some antenna parts, corner and connection
way? what to do with it?
this part probably need via under (can be found in TI usb BLE desgin http://www.ti.com/lit/ug/swru270b/swru270b.pdf) , as you can see the 20 mil via is little bit big
and over three pads all ground.
DRC return overlap and clearance errors, can I ignore it as it is overlap ground pads?
what else can I do?
center area
[attachment=2]center.gif[/attachment]
- the MCU part (which I did not design)
DRC return overlap and clearance errors for all its pads, can I ignore it as this are the MCU dimensions?
- MCU should have via under is ground plate as in the picture
DRC return overlap what should I do?
other
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my GND and VCC route are 10-16 mil instead of 8 mil, is it better?
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not all my route are 45deg because of space issues, is it critical?
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I have made some route T junctions,are they ok?
thanks