Void on BGA pad (please help)

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1

I’m working in Solder paste manufacturing industry and my customer has complainted the void issue on BGA pad. I’m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free solder paste. I could not see any void when I put component and I only see slight void when I conduct test without putting component.

However, I still could not differentiate the void level between good and bad paste.

Anybody has any idea how to perform the void test in Lab? Appreciate your advice??

Need urgent help…

Thanks & Regards,

2

Docker,

I’d suggest asking this question in the sci.electronics.design newsgroup on USENET. You’re likely to find more folks there who have expertise in this area. One access point to it is via http://groups.google.com/group/sci.electronics.design.

Your question isn’t quite clear, but if you’re looking for inspection methods, X-ray is common for inspecting BGA solder joints.

Cheers,

Richard