A post in another thread has brought up a question in my mind (and bear with me - pretty much all my circuits to date are low speed, 6MHz or less).
I do have a circuit with a 25Mhz crystal on it this time.
In the thread for konguk’s USB/microcontroller PCB, user bigglez put a cut-out in the ground plane around the crystal, its load capacitors and the tracks going back to the uC. Presumably this is to reduce parasitic capacitance around the crystal and its tracks to get a better wave form.
Looking at various factory-made PCBs that I have to hand, I see that some designers have cut out the ground plane around crystals and some haven’t. For example, for the 25MHz crystal oscillator (i.e. a 4 pin through-hole can, rather than a crystal/resistor/load capacitor arrangement) on a 3com ethernet card I have here, there’s a ground plane cut out under the oscillator, but not on the track that leads from the oscillator to the IC. On the same card, there’s another crystal oscillator, 20MHz, which has a ground plane cutout that includes the track to the IC.
Looking at Wiznet’s W5100 breakout board, they have a ground plane extending all the way underneath the crystal/load capacitors/resistor/tracks to IC. However, the tracks are very short, I think their PCB is probably 6 layer and they’ve been able to put the xtal and its associated parts within a couple of millimetres of the IC, so each track is only about half the length of an SMD 25MHz crystal.
So, if you were designing a PCB including a crystal oscillator, what would make you decide whether or not to cut out the ground plane underneath the oscillator and its tracks to the IC? I’m presuming the answer will be on the lines on whether a clean signal is most critical, or reducing emissions is the most critical design consideration… or whether it’s a case of “you should ALWAYS cut out the ground plane around the oscillator, anything else is potentially bad design”.