Sorry, I don’t have anything to add about helping you lay out your board… I just wanted to say it’s been awesome following this thread and watching the design come together from all the great people helping in here.
That is all. Carry on. 
Your layout is much better than previous versions!SpikedCola:
As for mounting a heatsink, I was planning to use a heatsink that was just large enough to cover the back of the chip, but protruded towards the back of the case and perhaps even out the back.…
I actually like this layout better as it gives me more room for the larger input signal capacitors
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v1.2: (image deleted)
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EDIT I also moved the caps and connectors down a bit to give me room if I decide to go with a larger heatsink
I would swap the location of the power connector and
the two large caps. In the physical world you may have
trouble inserting or removing the connector due to the
caps height and the heatsink hardware.
I don’t see any “breezeway” between the caps. You
should plan on the cans being oversize in EAGLE, as we
have discussed several times earlier. Better yet, buy
all the components before sending the PCB to China
for fab, and use a caliper to measure accurately.
A PCB that is too tight for parts is nothing more
than a “green coaster” for your coffee mug!
(1) Cap on top left is not in line with cap on top right?SpikedCola:
Image deleted
(2) How tall are these caps?
(3) How much space is needed for the IC mounting hardware?
(4) There are no mounting holes on the PCB?
(5) “U3” is the only designator in the silk screen layer?
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aligned
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added holes (heatsink will be mounted to case to hold up back side of board
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I was planning on using the hole in the IC tab, however I may experiment with an aluminum bar once I have it assembled
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turned on tNames layer
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caps are 35.5mm tall
