Dear Forumers!
I’ve designed a PCB for home usage and I’ve selected a most appropriate chip (PIC MCU) for the tasks to serv. When I started to design the PCB I assumed that the chip is available in TQFP 64 package, so all component placement and routing relied on this plan. Suddenly it’s reveiled that the chosen chip is not available in my country in TQPF 64 package. I can only order form the distributor in QFN 64 package.
My question is that, can I simply solder a QFN 64 chip onto the pad of a TQFP 64 chip? I think you can guess that many vias and routings are beneath the thermal pad of the QFN 64 chip. My PCB will be manufactured with high class PCB manufacturing technology, so the via’s placing will be accurate enough, and also solder mask will be top the vias and the top layer of the PCB.
Can it cause any problem in normal operation?
Thank you in advance!