This is probably a very dumb question, but: should I expect to be able to reflow PCBs (FR4 laminate) that have no solder mask, using lead-free temps, without scorching them? Everything I read online about toaster-oven reflow soldering makes it look totally magical, but my boards either come out with a bad sunburn (at 230 C – at 245 C they turn black), or else they have bad solder joints. So I wonder if (a) I’m just doing it wrong, or (b) solder mask gives the boards just enough extra protection that they don’t burn (or if they do it isn’t visible), or (c) most people aren’t using this annoying lead-free solder.
Background: I use Ameritronics ZeroLoad solder paste (96.5 Sn / 3 Ag / 0.5 Cu), with a melting point of 217-219 C. When I assemble my boards with a hot air pencil (set to 325 C but I don’t believe it) and preheater everything works fine (except that I often get shorts underneath a small LED with a QFN-like package – which is why I want to try reflow).
I’m using a B&D Infrawave toaster oven, being controlled by an Arduino with a SparkFun thermocouple and a MAX6675 chip and my own code. I’m fairly confident that I’m measuring the temp accurately (at least, it more or less agrees with my cheapy Harbor Freight IR thermometer doodad, and a regular kitchen oven thermometer too after a long lag), and after the preheat and soak steps (during which no scorching happens), the reflow step swinging above 217 C (topping out at 230 C) and back down takes under a minute, just as it should. And yet my PCBs go off like popcorn, or at least get visibly scorched.
Thanks!!
John Wilson
D Bit