Thermal resistance, heat sink location and size requeriments for M6E Nano

Sensors NFC & RFID
1

I am using the M6E Nano [(SEN-14066) Simultaneous RFID Tag Reader (SRTR) as a RedBoard [(DEV-13975) shield and I am having a hard time finding thermal parameters such as the desired termal resistance of the heat sink (area / size) and most importantly, how to attach the heat sink under this configuration (arduino shield instead of hardware serial), because [this post (item 4) says that the metal in the top (with the Novanta M6E sticker) is a metal RFI shield and doesnt have heat producing components thermally bonded to it.

If a heatsink can be attached there (the 2 center screw holes, because the headers woulnt let the heat sink be attached with the corner holes), should I remove the sticker to apply thermal compound or is it safe to apply it over the sticker (unlikely)?

Thanks!](Power for Simultaneous RFID Tag Reader (SRTR) - SparkFun Electronics Forum)](https://www.sparkfun.com/products/13975)](https://www.sparkfun.com/products/14066)

2

Per that previous post, you would want to place any heatsink on the bottom side of the board, not the top with the metal shield/sticker - putting it on top won’t help dissipate heat much.

As for the thermal parameters, that would kind of based on how hot it’s getting during use…I would try getting as close to covering the section of the white area the chip occupies (on the underside of the board https://cdn.sparkfun.com//assets/parts/ … no-03b.jpg ) as much possible, and see if its suits your use-case. While using this as a shield, keep in mind you’ll need to pick a heatsink that isn’t too tall.

Best of luck!