That via layout may not be manufacturable. Thermal vias in central pads are usually really small and lots of them…13-15 mil from what I’ve seen and used. The big via might be OK if you are intending only to solder this by hand.
However, I’m also required to comment on how some of the traces leading to the pins are actually wider than the solder pads, many are skewed at odd angles such that the clearance between traces might be too small to manufacture. Also confused about those traces that run along the inside of the solder pads, connect to the thermal pad, and apparently makes a near-90 degree crossing connection with the trace coming from the top right pad?