Bypassing question

Ok, so I’m laying out a board, and I’ve got a question about where to place vias to power/ground planes around the bypass caps. Does it change anything if I order it IC - via - cap or IC - cap - via? My first instinct is that it doesn’t, but I’m sometimes surprised by things that matter for good high frequency design.

Thanks!

Option 1:

Option 2:

IC-cap-via is best, it reduces the length of the connection and minimises inductance. Two vias are better than one, close to the capacitor, for really high-speed stuff like FPGAs.