I have a soldering station that allows BGA rework. I also have a BC01bv Single Chip Bluetooth solution, but I think it is impossible to make a PCB for it. I thought to write here may be Gurus could advice me a method.
I learned UV-photoresist and made footprint of Nokia 6100 LCD successfully down to 0.4mm lines, but well, my bluetooth chip has a 9x9 grid and I can’t imagine how each dot of this matrix will be addressed.
MichaelN:
You’ll probably need at least a 4-layer board, so don’t even think about trying to make it yourself.
BatchPCB ($8.00/sq. inch for 4-layer) would be a good option if you only need a small PCB; otherwise GoldPhoenix has 75 sq. inch for $200.
I’m going to try at least, to make a prototype PCB on one layer. May be it is toward another failure, but well, may teach me something new.
What I can’t understand yet, is the 8Xe on the datasheet, that is the distance between balls positions. Could you please have a look, what is that BSC unite of measurement there please?
If I know it, I’ll produce a footprint on Eagle and try an UV-photoresist attempt to get a normal PCB. I have an IR-BGA-rework station and will try to make an adapter at least.
I don’t understand why there is two table of information with the nearly same information!
The part comes in two versions. They differ in the thichness of the package. You use the table for the version of the part you are buying. It looks like the PCB footprint would be the same for both versions.
What is the meaning of this 8x used in various ways, like 8Xe, 8Xb, and at the bottom: 8X8X1?
8Xe means 8 times the value corresponding to e.
8x8x1 is the overall nominal package size, 8mm x 8mm x 1mm
What is the radius of each ball there please? Can’t read it!
It’s spec’ed as 81Xb, so each ball has a diameter of b (0.35 to 0.45 mm)
I don’t understand why there is two table of information with the nearly same information!
The part comes in two versions. They differ in the thichness of the package. You use the table for the version of the part you are buying. It looks like the PCB footprint would be the same for both versions.
What is the meaning of this 8x used in various ways, like 8Xe, 8Xb, and at the bottom: 8X8X1?
8Xe means 8 times the value corresponding to e.
8x8x1 is the overall nominal package size, 8mm x 8mm x 1mm
What is the radius of each ball there please? Can’t read it!
It’s spec’ed as 81Xb, so each ball has a diameter of b (0.35 to 0.45 mm)
/mike
Seems pretty clear to me. No offense, but I think you're going to struggle with your design if you had trouble interpreting this info:
1: yes, the footprint would be the same for both versions. Not sure why they have a separate table for each version, but it doesn’t matter.
3: 8Xe means all pin spacings are the same (e=0.8mm)
4: 81Xb means all 81 balls are the same (b = 0.35mm to 0.45mm)