PCB for BGA?

Hi,

I have a soldering station that allows BGA rework. I also have a BC01bv Single Chip Bluetooth solution, but I think it is impossible to make a PCB for it. I thought to write here may be Gurus could advice me a method.

I learned UV-photoresist and made footprint of Nokia 6100 LCD successfully down to 0.4mm lines, but well, my bluetooth chip has a 9x9 grid and I can’t imagine how each dot of this matrix will be addressed.

Please give ideas thank you :smiley:

You’ll probably need at least a 4-layer board, so don’t even think about trying to make it yourself.

BatchPCB ($8.00/sq. inch for 4-layer) would be a good option if you only need a small PCB; otherwise GoldPhoenix has 75 sq. inch for $200.

MichaelN:
You’ll probably need at least a 4-layer board, so don’t even think about trying to make it yourself.

BatchPCB ($8.00/sq. inch for 4-layer) would be a good option if you only need a small PCB; otherwise GoldPhoenix has 75 sq. inch for $200.

I’m going to try at least, to make a prototype PCB on one layer. May be it is toward another failure, but well, may teach me something new.

What I can’t understand yet, is the 8Xe on the datasheet, that is the distance between balls positions. Could you please have a look, what is that BSC unite of measurement there please?

If I know it, I’ll produce a footprint on Eagle and try an UV-photoresist attempt to get a normal PCB. I have an IR-BGA-rework station and will try to make an adapter at least.

BSC is Basic Spacing between Centres: the ball pitch for a BGA. It’s 0.8 mm for that device.

You need a multi-layer board to get the signals out, with vias connected to each pad.

leon_heller:
BSC is Basic Spacing between Centres: the ball pitch for a BGA. It’s 0.8 mm for that device.

You need a multi-layer board to get the signals out, with vias connected to each pad.

Thank you! May I ask some more questions on this page please? It is first time I’m reading a datasheet of a BGA device.

  1. I don’t understand why there is two table of information with the nearly same information!

  2. What is the usage of BSC, when there could be simply written mm please?

  3. What is the meaning of this 8x used in various ways, like 8Xe, 8Xb, and at the bottom: 8X8X1?

  4. What is the radius of each ball there please? Can’t read it! :frowning:

I’d suggest that this part is impossible to route out with less than 4 layers; and depending on exact ballout; could need as many as 6 layers.

Its not going to happen on a home made board.

–David Carne

Could anybody please answer questions about datasheet? :oops:

BSC is a standard term for measurements between centres. It is in mm, if you look at the table.

8x8 means 8 by 8.

You need to learn how to read datasheets.

  1. I don’t understand why there is two table of information with the nearly same information!

The part comes in two versions. They differ in the thichness of the package. You use the table for the version of the part you are buying. It looks like the PCB footprint would be the same for both versions.

  1. What is the meaning of this 8x used in various ways, like 8Xe, 8Xb, and at the bottom: 8X8X1?

8Xe means 8 times the value corresponding to e.

8x8x1 is the overall nominal package size, 8mm x 8mm x 1mm

  1. What is the radius of each ball there please? Can’t read it!

It’s spec’ed as 81Xb, so each ball has a diameter of b (0.35 to 0.45 mm)

/mike

n1ist:

  1. I don’t understand why there is two table of information with the nearly same information!

The part comes in two versions. They differ in the thichness of the package. You use the table for the version of the part you are buying. It looks like the PCB footprint would be the same for both versions.

  1. What is the meaning of this 8x used in various ways, like 8Xe, 8Xb, and at the bottom: 8X8X1?

8Xe means 8 times the value corresponding to e.

8x8x1 is the overall nominal package size, 8mm x 8mm x 1mm

  1. What is the radius of each ball there please? Can’t read it!

It’s spec’ed as 81Xb, so each ball has a diameter of b (0.35 to 0.45 mm)

/mike

Seems pretty clear to me. No offense, but I think you're going to struggle with your design if you had trouble interpreting this info:

1: yes, the footprint would be the same for both versions. Not sure why they have a separate table for each version, but it doesn’t matter.

3: 8Xe means all pin spacings are the same (e=0.8mm)

4: 81Xb means all 81 balls are the same (b = 0.35mm to 0.45mm)

Thank you very much all! Now it is enough clear to me. I promise that will learn to read everything the datasheet contents: I know it is a “must”.

:smiley: