I have allot of SMDs connected to a copper power plane on a densely populated board. The thermal relief on each pad (i.e. the absent copper encircling the pad) obviously plays an important role when hand-soldering or reworking, but does this have any purpose if the board is destined for an oven?
I ask because I suspect that removing the thermal relief from pads on a densely populated PCB and having more flooded copper will be beneficial in other ways (e.g. current, EMI, etc).