Should I use thermal relief on pads if destined for oven?

I have allot of SMDs connected to a copper power plane on a densely populated board. The thermal relief on each pad (i.e. the absent copper encircling the pad) obviously plays an important role when hand-soldering or reworking, but does this have any purpose if the board is destined for an oven?

I ask because I suspect that removing the thermal relief from pads on a densely populated PCB and having more flooded copper will be beneficial in other ways (e.g. current, EMI, etc).

You won’t get the correct solder profile if you don’t use thermal reliefs.

Good point. I didn’t think about that :oops:

I found that I only needed to reduce the thermal relief spacing to enable the copper plane to ‘flow’ as I would like.