PCB problems with pads

Greetings!

I have a problem with connection of pads in 4-layer PCB (signal1-GND-POWER-signal2). Sometimes the pad doesen’t connect to inner layers of the board. For all pads i use a termal relief for the pad to connect to power plane.

So my question, is it necesary that the pads in inner layers have termal relief?

Will this solve my problem?

What are the bennefits of using relief in inner layers and what are the disadvantages?

If someone had the same problem, please help me.

Please look at folowing link.

http://shrani.si/f/3l/xt/3ZHqDv6X/padconnectproblem.png

I think that there would be no problem with full pouring the via. But i don’t know if it is good to fully pour the PAD in inner layers? Any suggestions?