Sorry for asking such a basic question, but what are chipscale packages and how do they releate/interact with BGAs?
I have had two different descriptions of “chipscale” and cannot determine which is correct.
Many thanks,
“Chipscale” refers to a class of packages and not a specific or well defined package. Generally it indicates that the package is close in size to the die itself, probably without bond wires. Some CSPs are implemented as a BGA, either packaged or with balls directly on the die. I’ve used others that are just leadless packages without solder balls.
So, if you see the term chipscale, think tiny, surface mount, leadless, and use the manufacturer’s land pattern recommendation for your PCB.