A check of my board

Hi All,

I have designed a very basic board for testing my chip. I dont have any schematics for this. It is simple board having

  1. the footprint of my IC,

  2. Banana plug holes for power supply, 2 caps for decoupling the power supply

  3. Pin headers for connecting external pins

  4. 3 potentiometers for biasing.

  5. 11 SMA connectors for high frequency signals.

I have some doubts:

  1. I am getting a DRC error named as “Dimension” near the edge of the SMA connector. I am unable to figure out what this exactly means. If i disable the Copper/Dimension check in the DRC under the Distance tab, this error goes off.

  2. The second DRC error I am getting is “Stop mask” at places where solder mask overlaps the dimension layer. Again disabling the above option sets this right.

  3. My frame has some characters 1,2,3 etc… Will these layer(Dimension) be a part of the manufactured board…

It would be best to post up your board so we can have a look at it.

It will try without seeing it though;

  1. The SMA connector may be close to the edge of the board.

  2. Don’t worry about this, it’s not an issue with BatchPCB or GoldPhoenix.

  3. The dimension layer should only have an outline of the board on it, nothing else.

Sry for not posting the link:

http://www.ece.utah.edu/~nagaraju/tosubmit.brd

Ohk so a few things:

  1. The dimension layer should only contain a box (line width: 0). This box is the edge of your board, where the board is cut.

  2. The part you have that has the boxes and the lines with letters/numbers, should be on a silkscreen layer, for batchpcb this is layer 121 “_tsilk”.

(The above two things will fix the dimension errors)

  1. You have a grid of 0.0000000001" or something crazy. I wouldn’t even think about going below 0.001"

To re align parts onto the new grid, hold ctrl while you click to move the part.

  1. All your traces seem to be the same width, power traces should really be thicker.

See how you go with that and post back if you have any issues!

The updated board is at the same location: http://www.ece.utah.edu/~nagaraju/tosubmit.brd

I have changed the edge of the board. Previously I used the frame command to draw the outline. Now I used the wire command and choose the Dimension layer for it.

I have changed the grid, however as one may guess, I am getting the off grid DRC error. How should I go about this? Should I delete all the traces and replace( almost like redoing the entire stuff). I tried moving the parts but I could not select some of the parts after I run the MOVE command, for ex I could not select my main IC under the move command.

I have rerouted the VDD trace with a width of 0.024 inches. Is it good enough. I have a current consumption of arnd 9mA from my digital VDD. Is it necessary even to increase the gnd trace width?

Thanks for all the support. :smiley:

You are using 5mil traces and 7mil vias, are you sure whoever is producing this board can handle that? 5mil traces is a fairly tight spec.

The only DRC errors I get now are stop mask, which can be ignored.

You could probably route that board with 8mil traces and 15mil vias without increasing its size.

Also you should look at using a ground plane for top/bottom. Especially if this is something to do with RF.

There’s even smaller 5mil vias under the chip.

If you are getting this made, other than the suggestions above, regarding trace/via size and ground plane, you should work on your silkscreen. You have unnamed parts, and names that are on top of pads.

Use the smash tool to break the names away from the part, so you can place the names on the board where they make the most sense.

What is a ground plane and how do i make it…I tried to search thru the forums and I understood that we need to draw a polygon connected to gnd. However, I am not very sure. Could you please help me with it…

I also noticed in one of the topics that there shouldnt be traces below a IC as it may short to gnd… Is the gnd plane have something to do with this?

Use copper pour instead of a ground plane, ground planes are usually used on multi-layer boards and are layers consisting entirely of copper (usually with no tracks). Grounded copper pour on the top and bottom of the board will help with stability and noise reduction. I think it’s done with a polygon in Eagle, as you say.

There’s nothing wrong with putting tracks under an IC.

Leon

I don’t know the difference between a ground plane and a simple copper pour. Are you saying, pour copper, but don’t associate it with ground?

Anyway, to do this in Eagle:

Select the polygon tool. Change the layer to the layer you want to create the copper pour (either top or bottom). Change the isolate value at the top to something larger than default. I use 16mil, but use whatever you are comfortable with. Draw the polygon around the entire dimensions of the board and connect it to itself to complete it.

If you are not associating this with ground, then just hit ratsnest now and your layer will fill.

If you want to associate this with ground:

Select the NAME tool and select the edge of your polygon. Name it the same as your ground layer (GND, VSS, …). Hit the ratsnest button and it should fill in the ground signal and fill in the board, living your other signals isolated.

Repeat for the other side of the board to do both sides.

If you google, you can find some tutorials on this, but the ones I found were more complex than they needed to be, or just old.

definitely name the pour “gnd”. I think plane and pour are interchangeable when it comes to eagle.

leon_heller:
Use copper pour instead of a ground plane, ground planes are usually used on multi-layer boards and are layers consisting entirely of copper (usually with no tracks).

Actually, I see the difference between Leon's definition of a ground plane and a pour right in his message. I just didn't read it carefully enough.

I guess both leon and TheDirty suggest the same procedure…

draw a polygon of bottom metal layer and name the net as a ground net(I have name as S$6).

And then I ran the ratsnest command and resulting is the final board…

It is placed in the same location:

http://www.ece.utah.edu/~nagaraju/tosubmit.brd

Does the board look fine now?

For submitting the gerber file… what do you mean by assigned polarity(positive/negative)… i have to specify it for each file I upload namely

.cmp :signal

.sol: signal

.plc: silk_screen

.sts :solder_mask for solder side

.stc : solder_mask for component side…

I’m in the middle of my very first Eagle project. I’ve tried a couple times over the years to learn eagle, and these type of things have always driven me nuts and cause me to give up on it. I’ve run the autorouter and it gives me two clearance errors, this is one of them:

http://picasaweb.google.com/mrperfectio … 3377060210

This is one pin of a 2x4 row connector out of the con-lstb library. Where the hell does the layer 1 “stuff” come from that is on the edge of this pad? If I move both the track and the part, it stays there. And I can’t select it or anything (this is what frustrates me to no end with eagle).

Oops… there’s nothing to see here. Either you do not have access to these photos, or they don’t exist at this web address. Please contact the owner directly to gain access.

Without seeing what’s happening, my only advice is, don’t use the autorouter.

Sorry, I fixed the link on the last page (I think), but here it is again

http://picasaweb.google.com/mrperfectio … 3377060210

Yeah, I probably should have done this board by hand as there aren’t a lot of traces. However, any other ideas for getting rid of this “debris” (as another user of another forum named it and got no good replies on what it was or how to fix it) other than just starting from scratch again. Have a look at the pic if you can. It’s really mind numbing wtf it is, why I can’t select it, etc.

Your trace is too close to the via, which is bad. You can select it - remember that right click will toggle through various selections, left accepts.

I’d rip up that trace and move it left a bit.

Yeah, I assumed that is what it was, however ripping the trace up and moving it leaves the leftover red trace on the edge of the via and re-running DRC flags the spot as an error regardless of a trace being there or not. I’m ignoring it for now, I may come back to it if I get interested enough to figure out if it is a library part issue or some other bizarro thing going on.

Ripup starts out removing only a segment at a time. Its most likely not a library issue.